Maitiro Ekugadzira Waya Yesimbi Yakaputirwa Nemhangura Inogadzirwa NeElectroplating Uye Kukurukurirana NezveCommo

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Maitiro Ekugadzira Waya Yesimbi Yakaputirwa Nemhangura Inogadzirwa NeElectroplating Uye Kukurukurirana NezveCommo

1. Nhanganyaya

Tambo yekutaurirana mukutumira masaini ane mafrequency akakwira, madhaimani achaita kuti ganda rishande, uye nekuwedzera kwehuwandu hwechiratidzo chinotumirwa, ganda rinoshanda zvakanyanya. Chinonzi ganda rinoita kuti mafambiro ezviratidzo aenderane nekunze kwemudhaimani wemukati nekunze kwemudhaimani wekunze wetambo ye coaxial kana huwandu hwechiratidzo chinotumirwa huchisvika makirohertz akati wandei kana makumi ezviuru zvehertz.

Zvikuru sei, nemitengo yemhangura iri kukwira pasi rose uye zviwanikwa zvemhangura zviri kuramba zvichiwedzera kushomeka, saka kushandiswa kwesimbi yakaputirwa nemhangura kana waya yealuminium yakaputirwa nemhangura kutsiva maconductor emhangura, kwave basa rakakosha kuindasitiri yekugadzira waya netambo, asiwo mukusimudzirwa kwayo nekushandisa nzvimbo yakakura yemusika.

Asi waya iri mu copper plating, nekuda kwe pre-treatment, pre-plating nickel nedzimwe nzira, pamwe nekukanganiswa kwe plating solution, zviri nyore kugadzira matambudziko anotevera nezvikanganiso: wire blackening, pre-plating haina kunaka, main plating layer kubva paganda, zvichikonzera kugadzirwa kwewaya yakasviba, tsvina yezvinhu, kuitira kuti mitengo yekugadzira chigadzirwa iwedzere. Saka, zvakakosha zvikuru kuve nechokwadi chemhando ye coating. Pepa iri rinonyanya kutaura nezve misimboti yemaitiro uye maitiro ekugadzira waya yesimbi yakaputirwa ne copper-clad ne electroplating, pamwe nezvikonzero zvinowanzoita matambudziko emhando uye nzira dzekugadzirisa. 1 Copper-clad steel wire plating process uye zvikonzero zvayo

1. 1 Kugadziriswa kwewaya isati yatanga
Kutanga, waya inonyudzwa mumushonga wealkaline nepickling, uye voltage yakati inoiswa pawaya (anode) neplate (cathode), anode inokonzeresa okisijeni yakawanda. Basa guru remagasi aya nderekuti: chekutanga, mabubble ane simba pamusoro pewaya yesimbi uye electrolyte yayo iri pedyo inoita kuti anode itsvedzerere uye ibvise mafuta, nokudaro ichisimudzira mafuta kubva pamusoro pewaya yesimbi, ichikurumidzisa saponification uye emulsification yemafuta nemafuta; chechipiri, nekuda kwemabubble madiki akabatana neinterface iri pakati pesimbi nemhinduro, mabubble newaya yesimbi zvichibuda, mabubble acho achanamatira pawaya yesimbi ine mafuta akawanda pamusoro pemhinduro, saka, paMabubble acho achaunza mafuta akawanda achinamatira pawaya yesimbi pamusoro pemhinduro, nokudaro achikurudzira kubviswa kwemafuta, uye panguva imwe chete, hazvisi nyore kugadzira hydrogen embrittlement yeanode, kuitira kuti pave nekuiswa kwakanaka kwepurasitiki.

1. 2 Kuputira waya
Kutanga, waya yacho inogadziriswa kare uye inoputirwa nickel nekuinyudza mumushonga wekuisa simbi uye kuisa voltage yakati kuti pawaya (cathode) uye pacopper plate (anode). Paanode, copper plate inorasikirwa nemaerekitironi uye inoumba ma free divalent copper ions mu electrolytic (plating) bath:

Cu – 2e→Cu2+
Pa cathode, waya yesimbi inodzokororwazve nemagetsi uye maion emhangura ane divalent anoiswa pawaya kuti agadzire waya yesimbi yakaputirwa nemhangura:
Cu2 + + 2e→ Cu
Cu2 + + e→ Cu +
Cu + + e→ Cu
2H + + 2e→ H2

Kana huwandu hweasidhi mu plating solution husina kukwana, cuprous sulphate inonyungudutswa nyore nyore kuti igadzire cuprous oxide. Cuprous oxide inobatwa mu plating layer, zvichiita kuti isununguke. Cu2 SO4 + H2O [Cu2O + H2 SO4

I. Zvikamu Zvikuru

Tambo dzekunze dzinoshandiswa nemaziso dzinowanzova neshinda dzisina chinhu, chubhu yakasununguka, zvinhu zvinodzivirira mvura, zvinhu zvinosimbisa, uye sheath yekunze. Dzinouya muzvivakwa zvakasiyana-siyana zvakaita sekugadzirwa kwechubhu yepakati, kusungirirwa kwelayer, uye chimiro cheskeleton.

Mafiber asina chinhu anoreva mafiber epakutanga ane dhayamita yema micrometer mazana maviri nemakumi mashanu. Anowanzo sanganisira core layer, cladding layer, uye coating layer. Mhando dzakasiyana dzemafiber asina chinhu ane saizi dzakasiyana dzecore layer. Semuenzaniso, mafiber eOS2 ane mode imwe chete anowanzova ma micrometer mapfumbamwe, nepo mafiber eOM2/OM3/OM4/OM5 akawanda ari ma micrometer makumi mashanu, uye mafiber eOM1 akawanda ari ma micrometer makumi matanhatu nemaviri. Mafiber asina chinhu anowanzo nyorwa nemavara kuti asiyanise mafiber ane macore akawanda.

Machubhu asina kusimba anowanzogadzirwa nepurasitiki yakasimba yePBT uye anoshandiswa kugadzika machira asina chinhu. Anopa dziviriro uye anozadzwa negel inovhara mvura kudzivirira kupinda kwemvura kunogona kukuvadza machira. Gel inoshandawo senzira yekudzivirira kukuvara kwefiber kubva pakukuvadzwa. Maitiro ekugadzira machubhu asina kusimba akakosha kuve nechokwadi chekuti fiber yakareba.

Zvinhu zvinovhara mvura zvinosanganisira grisi rinovhara mvura netambo, shinda rinovhara mvura, kana upfu hunovhara mvura. Kuti uwedzere kugona kwetambo kudzivirira mvura, nzira huru ndeyekushandisa grisi rinovhara mvura.

Zvinhu zvinosimbisa zvinouya mumhando dzesimbi nedzisiri dzesimbi. Zvesimbi zvinowanzogadzirwa newaya dzesimbi dzine phosphate, matepi earuminiyamu, kana matepi esimbi. Zvinhu zvisiri zvesimbi zvinonyanya kugadzirwa nezvinhu zveFRP. Pasinei nezvinhu zvinoshandiswa, zvinhu izvi zvinofanirwa kupa simba remuchina rinodiwa kuti zvisangane nezvinodiwa zvakajairwa, zvinosanganisira kuramba kumanikidzwa, kukotama, kukanganiswa, uye kutenderedzwa.

Masheya ekunze anofanirwa kufunga nezvenzvimbo yekushandisa, kusanganisira kudzivirira mvura, kudzivirira UV, uye kudzivirira mamiriro ekunze. Saka, zvinhu zvitema zvePE zvinonyanya kushandiswa, sezvo hunhu hwazvo hwakanaka hwemuviri nemakemikari hunoita kuti zvikwanise kuiswa panze.

2 Zvinokonzera matambudziko emhando yepamusoro mukugadzirwa kwepurasitiki yemhangura uye mhinduro dzayo

2. 1 Kukanganiswa kwekugadzirisa waya pachigadziko chepurasitiki Kugadzirisa waya pachigadziko chepurasitiki kwakakosha zvikuru mukugadzirwa kwewaya yesimbi yakaputirwa nemhangura nemagetsi. Kana firimu remafuta neokisijeni riri pamusoro pewaya risina kubviswa zvachose, saka chigadziko chenickel chakaputirwa kare hachina kuputirwa zvakanaka uye kubatana kwacho kwakashata, izvo zvinozopedzisira zvaita kuti chigadziko chikuru chesimbi chesimbi chiwire pasi. Saka zvakakosha kutarisa huwandu hwealkaline nepickling liquids, pickling nealkaline current uye kana mapombi ari akajairwa, uye kana asina, anofanira kugadziriswa nekukasika. Matambudziko emhando yepamusoro akajairika mukugadzirisa waya yesimbi nemhinduro dzayo anoratidzwa muTafura

2. 2 Kugadzikana kwe pre-nickel solution kunosarudza zvakananga kunaka kwe pre-plating layer uye kunoita basa rakakosha padanho rinotevera re copper plating. Saka, zvakakosha kuongorora nguva dzose nekugadzirisa composition ratio ye pre-plated nickel solution uye kuona kuti pre-plated nickel solution yakachena uye haina kusvibiswa.

2.3 Kupesvedzera kwemhinduro huru yekuisa mapurasitiki pachikamu chekuisa mapurasitiki. Mhinduro yekuisa mapurasitiki ine copper sulphate nesulfuric acid sezvikamu zviviri, kuumbwa kwechiyero kunosarudza zvakananga kunaka kwechikamu chekuisa mapurasitiki. Kana huwandu hwe copper sulphate hwakanyanya, makristaro e copper sulphate achakwidibira; kana huwandu hwe copper sulphate hwakanyanya kuderera, waya ichatsva zviri nyore uye kushanda kwekuisa mapurasitiki kuchakanganiswa. Sulphuric acid inogona kuvandudza electrical conductivity uye kushanda kwe electroplating solution, kuderedza huwandu hwe copper ions mu electroplating solution (iyoyo ion effect), nokudaro ichivandudza cathodic polarization uye kupararira kwe electroplating solution, kuitira kuti current density limit iwedzere, uye kudzivirira hydrolysis ye cuprous sulphate mu electroplating solution kuita cuprous oxide uye precipitation, zvichiwedzera kugadzikana kwe plating solution, asiwo kuderedza anodic polarization, iyo inobatsira kuti anode inyungudike zvakajairika. Zvisinei, zvinofanira kucherechedzwa kuti huwandu hwakawanda hwe sulphuric acid hunoderedza kunyungudika kwe copper sulphate. Kana huwandu hwe sulphuric acid mu plating solution husina kukwana, copper sulphate inonyungudutswa nyore nyore kuita cuprous oxide uye inobatwa mu plating layer, ruvara rwe layer runova rwakasviba uye rwakasununguka; kana paine sulphuric acid yakawandisa mu plating solution uye huwandu hwe copper salt husina kukwana, hydrogen inoburitswa zvishoma mu cathode, zvekuti pamusoro pe plating layer panoita sepakaita madota. Huwandu hwe phosphorus mu phosphorus mu plating plate hunewo simba guru pamhando ye coating, huwandu hwe phosphorus hunofanira kudzorwa kubva pa 0.04% kusvika 0.07%, kana huri pasi pe 0.02%, zvakaoma kugadzira firimu kudzivirira kugadzirwa kwema ions e copper, nokudaro zvichiwedzera copper powder mu plating solution; Kana huwandu hwephosphorus hunopfuura 0.1%, zvinokanganisa kunyungudika kweanode yemhangura, zvekuti huwandu hwemaion emhangura ane mavalent ari mu plating solution hunoderera, uye hunogadzira matope akawanda eanode. Pamusoro pezvo, plate yemhangura inofanira kusukwa nguva nenguva kudzivirira anode sludge kuti isasvibise plating solution uye kukonzera roughness uye burrs mu plating layer.

3 Mhedziso

Kuburikidza nekugadzirisa zvinhu zvataurwa pamusoro apa, kunamira uye kuenderera mberi kwechigadzirwa kwakanaka, mhando yacho yakagadzikana uye mashandiro acho akanaka kwazvo. Zvisinei, mukugadzirwa chaiko, pane zvinhu zvakawanda zvinokanganisa mhando yeplating layer muplating process, kana dambudziko rawanikwa, rinofanira kuongororwa uye kudzidzwa nenguva uye matanho akakodzera anofanira kutorwa kuti rigadziriswe.


Nguva yekutumira: Chikumi-14-2022